ISTE (CEO Chang-Hyun Cho), a global semiconductor equipment company, announced that it has signed a KRW 2.3 billion contract with SK Hynix to supply HBM-specific FOUP Cleaner equipment. The equipment is scheduled for delivery by April 7, 2026.
Last November, ISTE also supplied FOUP cleaner equipment worth KRW 2.83 billion to SK Hynix. The company stated that this initial shipment was in response to new and expanded investments aimed at strengthening HBM competitiveness. The company anticipates additional orders for HBM-related equipment in the future.
In addition, in November of last year, the company received orders for FOUP composite equipment worth 1.57 billion won from Amkor Technology Korea and FOUP Cleaner equipment from Samsung Electronics, and the deliveries are scheduled for March and April of this year.
In 2013, ISTE developed the world's first FOUP Cleaner equipment capable of separating the body and cover for cleaning. Beginning with the supply of FOUP Cleaners to SK Hynix in 2016, ISTE expanded its collaboration to include automation equipment, valve repair, and equipment parts. In 2023, ISTE was designated as an SK Hynix Technology Innovation Company, strengthening its partnership with key customers.
CEO Cho Chang-hyun stated, "The FOUP Cleaner equipment is essential for stabilizing the HBM production line and is linked to SK Hynix's investment to strengthen its HBM competitiveness." He added, "In addition to our existing equipment, we have successfully localized PECVD equipment for the SiCN process, adding key front-end equipment to our product line." He added, "We plan to strengthen our repeat order structure, focusing on key customers, to build a foundation for stable growth."
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