Terahertz technology and solutions company TeraVue (CEO Don Arnon) announced on the 5th that it has signed a multi-year service agreement with a Fortune 500 company located in the United States that supplies high-bandwidth memory (HBM) to AI chip manufacturers.
The company under this contract is an HBM supplier that has been using Terraview's EOTPR equipment, which uses terahertz waves to inspect internal microcracks that can occur during the semiconductor packaging process. Terraview expects this service agreement to expand the scope of its equipment's application while ensuring continued use.
According to Terraview, the EOTPR equipment will be used to precisely analyze the location and cause of micro-defects occurring during the HBM packaging process, and will be applied across the customer's HBM3 and HBM4 development, yield optimization, and test and measurement workflows. This agreement, which follows an existing deal, demonstrates that major global HBM manufacturers are utilizing the solution in their next-generation memory development and quality assurance processes.
NVIDIA previously adopted EOTPR as a priority technology for its AI chip quality assurance and failure analysis workflows and encouraged its partners to use the equipment. Terraview sees this agreement as part of a broader trend among HBM suppliers to NVIDIA to adopt EOTPR to meet their required quality standards.
Terraview anticipates continued growth in demand for inspection equipment as the AI and HBM markets expand, and is also preparing a domestic patent application for the EOTPR 4500. This patent, which covers a key technology that will be utilized in future automated AI chip production, including an automatic probe system, has also secured similar patents in the US and Taiwan.
Terraview plans to expand its research workforce and advance its technology to respond to the future growth of the AI semiconductor and ultra-precision inspection equipment markets.
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