Coasia Semiconductor signs a mass production agreement with Tenstorent for next-generation AI chiplets at CES 2026.

Coasia Semi announced on the 6th (local time) at 'CES2026' held in Las Vegas, USA that it signed a contract with global AI semiconductor company Tenstorrent for mass production of 'next-generation AI chiplets'.

This contract builds on the chiplet development contract for Tensorrent AI processors signed in late 2024, and is a follow-on mass production contract following the completion of the design. It also marks Coasia Semiconductor's second contract for mass production of AI chiplets, following the supply contract for Rebellion AI products signed in July 2025.

The company expects total sales of over 140 billion won through this contract, and anticipates that mid- to long-term sales growth will also expand as the number of projects that can transition from the development stage to mass production increases.

For this project, Coasia Semiconductor will be responsible for chiplet architecture design and verification, foundry manufacturing, and mass production. To achieve this, the company will be responsible for the technologies required for all aspects of chiplet development, including individual SoC chip design and chiplet package design.

“Coasia Semiconductor is a trusted partner for Tenstorrent’s chiplet SoC implementation,” said Jim Keller, CEO of Tenstorrent. “Following this agreement, we plan to begin development of follow-up products soon.”

“This contract is a testament to Coasia’s expertise in chip design and chiplet package development,” said Shin Dong-soo, CEO of Coasia Semiconductor. “Based on this, we will continue to lead the global AI ASIC market.”


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