YMC, a company specializing in semiconductor and display materials and components, announced that it has made a strategic investment of $1 million in Samba Solutions, Inc., a semiconductor equipment startup based in Silicon Valley, USA, to strengthen its future technological competitiveness.
This investment was part of Samba Solutions' pre-Series A (Series Seed) round. Samba Solutions, a startup led by former employees from global semiconductor equipment companies, is attracting industry attention for its innovative dry etching technology.
Through this investment, YMC plans to preemptively secure promising technologies in the field of dry etching equipment applicable to next-generation advanced packaging processes such as high bandwidth memory (HBM) and through-silicon via (TSV), while also promoting the expansion of its global technology network.
The company believes that combining its semiconductor component manufacturing and recycling expertise with Samba Solutions' design capabilities will create synergy in the high-performance etching equipment market, where demand is increasing due to process miniaturization.
YMC views this investment not as a simple financial commitment (FI), but as a strategic investment based on technological collaboration. Dry etching is considered a key technology in the future semiconductor equipment market. YMC's strategy is to rapidly acquire the latest technological trends through collaboration with promising US startups and incorporate them into its own processes and product development.
“This investment is a strategic step toward strengthening our global competitiveness in the semiconductor technology sector,” said Park Jeong-geun, YMC’s Chief Financial Officer. “By combining Samba Solutions’ technological prowess with YMC’s manufacturing capabilities, we will build a competitive business model targeting the next-generation semiconductor market.”
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