HyperExcel and Advantech Sign MOU for AI Infrastructure Technology Collaboration

AI semiconductor startup HyperAccel announced on the 3rd that it has signed a memorandum of understanding (MOU) with Advantech, a global company in the IoT intelligent systems and embedded platforms sector, for cooperation in AI infrastructure technology.

The MOU signing ceremony took place on February 2nd at HyperExcel's headquarters in Seoul. Through this agreement, the two companies discussed technological collaboration in the AI semiconductor field and laid the foundation for a mid- to long-term strategic partnership.

HyperExcel is an AI semiconductor startup that designs its own high-efficiency semiconductor LPU specialized for large-scale language model inference. It is developing next-generation AI semiconductor technology based on chip design technology that simultaneously enhances AI inference performance and power efficiency.

Advantech boasts a global customer base and hardware platforms used in diverse industries, including industrial computing, embedded systems, robotics, and medical. Recently, the company has identified AI technology as a key growth driver and is focusing on expanding its edge AI and next-generation AI computing ecosystem.

Through this agreement, the two companies will engage in technological exchanges across AI infrastructure technologies and will gradually explore various possibilities for collaboration based on each company's technological expertise and know-how.

HyperExcel CEO Kim Joo-young said that this agreement will serve as an opportunity to seriously discuss cooperation with global industrial computing companies on AI infrastructure technology, and that the company will build a long-term cooperative relationship so that its AI semiconductor design technology can expand into the global industrial market.

Miller Chang, President of Advantech's Embedded Business Unit, said that based on his experience applying AI computing technology to various industrial environments, he expects new possibilities for collaboration centered on AI semiconductor technology through collaboration with HyperExcel, which has strengths in AI inference efficiency.


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