Semiconductor equipment specialist IST announced on the 9th that it has secured an additional contract to supply HBM-specific FOUP cleaner equipment from SK Hynix. Under this contract, IST plans to supply the equipment to SK Hynix by July 21st of this year.
In January, IST also received an order for HBM-specific hoop cleaner equipment from SK Hynix, and at the time, the company predicted continued demand linked to investments aimed at strengthening HBM competitiveness. The semiconductor industry has been investing in new production lines, upgrading existing fab processes, and enhancing operational stability. In particular, in high-value-added memory processes such as HBM, cleanliness management during wafer transport and storage and ensuring process reliability are emerging as key competitive factors.
IST's wafer cleaner equipment enhances process stability by removing contaminants generated during wafer transport and storage. This equipment has been used to strengthen capabilities for not only existing memory processes but also HBM processes. This additional order is considered significant because it simultaneously secures new investment demand while improving HBM pre- and post-processing.
An IST official stated, “We are continuing to supply HBM-specific hoop cleaners in line with SK Hynix’s HBM production increase, and demand for equipment will continue due to increased production of HBM and DDR5 DRAM driven by the DRAM boom.” Going forward, IST plans to enhance its semiconductor process equipment lineup, including FOUP inspection (FOUP) complex equipment and PECVD, based on hoop cleaners, and expand its equipment supply to respond to the production environment of high-value-added memory and next-generation semiconductors.
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