Terahertz technology and solutions company Terraview (950250, CEO Donald Dominic Arnon) announced on the 9th that it is conducting research and development to enhance EOTPR functions in collaboration with a Fortune 500 company that supplies high-bandwidth memory (HBM) to global AI chip manufacturers.
EOTPR (Electro-Optical Terahertz Pulse Reflectometry) is an inspection equipment that utilizes terahertz (THz) technology to non-destructively detect defects and micro-flaws inside highly integrated semiconductor packages, and is used to improve yields. According to Terraview, this collaborating company is a customer that has previously purchased EOTPR equipment multiple times, and has continued to purchase it again after highly evaluating the equipment's inspection performance and suitability that exceeded standards during the preliminary performance testing stage.
The company proposed a research and development collaboration to further enhance EOTPR's precision inspection capabilities, and Terraview is focusing on developing a high-precision EOTPR inspection solution based on this collaboration. The background to this collaboration is that with the recent advancements in HBM structures and manufacturing processes, existing inspection technologies are limited in detecting defects and cracks within laminated structures.
Terraview explained that its continuous improvement in the probe accuracy and precision of its HBM and AI chip inspection solutions, coupled with the clear efficiency and expected benefits of applying the inspection equipment to production lines, led to this collaboration. The company believes it will also be able to meet the demand for next-generation, high-performance semiconductor inspection using hybrid bonding technology.
Meanwhile, Terraview plans to participate in SEMICON Korea 2026, held at COEX in Seoul from February 11th to 13th, to introduce the new features of the EOTPR 4500 and discuss technology cooperation and business with global semiconductor companies.
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