Vieworks (CEO Husik Kim) exhibited its next-generation AI machine vision solutions at the Smart Factory & Automation Industry Exhibition (AW 2026), held at COEX in Samseong-dong, Seoul, from March 4th to 6th. At the Korea Vision Show booth, the company showcased a total of 31 products, including line scan and area scan cameras and industrial lenses.
On the first day of the exhibition, a presentation was held at the "2026 AI Machine Vision Technology Seminar" on the topic of "Next-Generation Machine Vision Application Solutions Based on the 100Gbps COF (CoaXPress-over-Fiber) Interface." COF technology utilizes optical fiber as a data transmission medium, designed to reliably transmit large amounts of image data captured by ultra-high-speed cameras at speeds of up to 100Gbps per second.
The seminar also unveiled two key solutions utilizing the COF interface. The "High-Sensitivity BSI Wide-View Imaging Solution" features a backside-illuminated (BSI) sensor, offering approximately 1.8 times the sensitivity of conventional solutions. It can simultaneously capture brightfield and darkfield environments in a single scan. It detects microscopic defects down to 0.35 micrometers (µm), and its autofocus function maintains scanning speed and inspection reliability.
Another solution, the 'High-Speed Multi-Mode Imaging Solution', simultaneously acquires images under four different lighting conditions in a single scan, supporting a resolution of up to 0.3µm.
Vieworks' machine vision solutions are expected to be utilized across ultra-precision manufacturing processes, including automatic optical inspection (AOI) of display panels, PCB manufacturing, and 3D measurement of semiconductor packaging. Kwon Hyuk-hoon, Head of the Optical and Imaging Division, stated, "To improve AI image processing performance, it is essential to quickly acquire and reliably transmit massive amounts of image data. Through COF interface-based technology, we will secure market competitiveness in various industrial fields, including 3D vision, robot vision, and semiconductor wafer inspection."
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