SMACK Expands Orders for Samsung Electronics DS Semiconductor Process Equipment

SMACK announced on the 5th that orders for semiconductor process equipment developed in collaboration with Samsung Electronics' DS division are continuing in earnest.

This equipment is a key component used to analyze defects occurring in semiconductor production processes. Since 2025, SMAC has been collaborating with Samsung Electronics on the joint development of new equipment aimed at improving performance, and has completed initial performance testing. The final testing phase is currently underway, focusing on stability and technical verification for practical application in production.

SMEC's business focuses on CNC machine tools and machining centers, and since 2021, it has been pursuing a joint semiconductor processing equipment development project with Samsung Electronics. To secure future growth engines, the company has invested in R&D and secured specialized personnel in the semiconductor equipment field. Long-term collaboration has also enhanced its technological expertise. Furthermore, SMEC has secured equipment reliability through on-site verification and customized technical support. Having supplied dozens of units to Samsung Electronics production sites, SMEC has earned recognition for its quality and performance. With this expanded order, SMEC plans to fully strengthen its semiconductor equipment business.

Building on the precision control, robot control, and position control technologies accumulated in its machine tool business, SMAC is expanding its business into cutting-edge industries such as semiconductor equipment. The strategy is to enhance the competitiveness of its convergence equipment business by combining existing mechanical technologies with automation and AI-based control systems.

CEO Choi Young-seop explained that the company is expanding its business into the advanced industrial equipment sector, leveraging the precision control technology it has acquired through machine tools and machining centers. He stated that in 2026, the company plans to strengthen its organization and workforce, focusing on the Convergence Business Division, and focus on B2B equipment businesses, including semiconductor analysis equipment, wet clean cleaning equipment, and high-speed loaders jointly developed with Samsung Electronics, Samsung Display, and Corning Precision Materials. He also added that the company plans to expand its business to include battery disassembly equipment and charging/discharging equipment, which were delivered to an automotive research institute in late 2025 and received positive reviews.

In recent years, in the semiconductor processing equipment and analysis facility sectors, demand for equipment that combines precision control and automation technologies has been increasing in line with the advancement of advanced processes.


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