Kosem, a company specializing in electron microscope-based convergence industrial equipment, announced on the 9th that it had been selected for the second phase of the AI Global Big Tech Project promoted by the Research and Development Special Zone Promotion Foundation under the Ministry of Science and ICT.
The AI Global Big Tech Project is a program designed to foster globally competitive AI companies and support their entry into overseas markets by leveraging the AI technology and research infrastructure of public research institutions, including universities and government-funded research institutes within research and development special zones. Through this project, KOSEM will receive a total of KRW 4.6 billion in R&D funding over three years.
The technology that Cosem is developing in this project is the Eirtron 300-AI, an AI-based atmospheric pressure electron microscope. Unlike conventional electron microscopes, which are primarily limited to vacuum environments, this device is designed to analyze samples in atmospheric pressure.
With this project as a catalyst, Cosem plans to pursue a market expansion strategy focused on the application of advanced semiconductor packaging processes. With the advancement of semiconductor microfabrication and packaging technologies, demand for high-speed, high-precision inspection at the process stage is increasing. The company plans to develop next-generation inspection solutions using AI-based atmospheric pressure electron microscope-based process analysis technology.
In addition, Cosem is developing core technologies in collaboration with researchers at the Electronics and Telecommunications Research Institute (ETRI) and major domestic universities, and plans to expand the scope of application to various industrial fields that require precise analysis, such as new materials research and bio-analysis, in addition to semiconductor inspection.
A company representative explained that this project selection signifies that atmospheric pressure electron microscopy technology has secured competitiveness applicable to advanced industries, including semiconductor packaging. The company further stated that it will continue to advance AI-based defect analysis and high-resolution image reconstruction technologies to expand its presence in the global semiconductor inspection equipment market.
In the semiconductor industry, the importance of inspection equipment is growing significantly due to process miniaturization and advancements in advanced packaging technology. In particular, as demand for precision measuring equipment incorporating AI-based analysis technology grows, related equipment companies are actively investing in R&D and participating in government-supported projects.
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