Wilco (CEO Sangwon Park) was selected for the ‘Ultra-Gap Link-up Program’ future mobility sector.
The 'Super Gap Linkup Program' is hosted by the Ministry of SMEs and Startups, and is operated by large and medium-sized companies participating as anchor companies to promote promising startups and technology verification (PoC). In this future mobility sector, global auto parts company Continental AG is participating as an anchor company, and Wilco has secured a PoC opportunity for CCL (copper clad laminate) utilizing high-heat dissipation paste and high-heat dissipation and low-k material technology.
In April, Wilco was selected for the 'Super Gap Startup 1000+ Project' based on its satellite communications and defense industry material technology, securing up to 600 million won in commercialization funds and support for global expansion. Then in June, it was selected as one of seven participating companies in the future mobility sector in the 'Link Up Program' in recognition of its capacity to develop materials for radar modules.
Wilco has been developing its own CCL material with low permittivity (Dk<3.5) and high thermal conductivity (>2.0 W/mK) that is effective in minimizing signal loss and dissipating heat in high-frequency and high-speed communication environments, and through this PoC, it will verify the applicability of the material to key future vehicle components such as HUD, HPC, and radar modules.
Wilco said that through collaboration with Continental, it plans to secure price competitiveness and technological independence based on the localization of substrate materials for battlefield components, and through this, explore the possibility of advancing into the global market.
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