RFHIC, a compound semiconductor company, announced in a public disclosure on June 17 that it had signed a supply contract with LIG Nex1 worth a total of KRW 47.6 billion. This amount is equivalent to approximately 41.4% of RFHIC’s projected sales in 2024.
The contracts are worth 29.7 billion won and 17.9 billion won respectively for the high-power power amplifier (SSPA, Solid State Power Amplifier) to be installed on medium-range surface-to-air guided missiles for overseas export and the transmit/receive module applied to the multi-function radar (MFR, Multi-Function Radar) system for naval vessels.
The medium-range surface-to-air guided missile system will feature RFHIC’s gallium nitride (GaN) semiconductor-based high-power power amplifier technology. The technology is designed to operate in extreme environments, providing performance suitable for radars in airborne and naval weapon systems, and is evaluated as a next-generation solution to replace the existing vacuum tube method (TWTA).
The transceiver module for the ship's multi-function radar is applied to the latest AESA (Active Electronically Scanned Array) radar system of foreign navies. The module based on GaN technology is attracting attention because it enables rapid radio direction change, thereby improving surveillance and engagement capabilities, and can respond to multiple targets simultaneously compared to the existing PESA (Passive Electronically Scanned Array) method.
RFHIC explained that through this contract, it has once again proven its GaN power amplifier technology and reliability in the defense industry. The company added that it currently has the technology to supply AESA radar components for not only ground and naval radars, but also airborne and satellite platforms.
An RFHIC official said, “This order goes beyond simple parts supply and is an example of RFHIC’s technological status in the field of advanced defense technology,” adding, “We plan to continue to expand our position in the global defense market through research and development and quality innovation.”
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