ASIC Land, a company specializing in application-specific integrated circuit (ASIC) design solutions, announced on the 5th that it has been finally selected as a joint research institute for the national project 'Development of chiplet-based interface and verification technology to increase AI semiconductor data processing efficiency' hosted by the Ministry of Science and ICT and the Institute of Information and Communications Technology Planning and Evaluation (IITP). The total project cost of this project is 17.5 billion won, and ASIC Land will participate in the development of core technologies together with the hosting organization, Dinoticia.
In this project, AegicLand will lead the development of the entire interface and packaging technology, including verification of chiplet architecture, backend design, interposer structure design, and signal and power integrity (SI/PI) analysis and verification of the package. Through this, it will focus on securing the basic technology that can maximize chip-to-chip connection efficiency and system performance.
In addition, with this research as an opportunity, Aegicland will fully launch the chiplet-based turnkey platform business, 'CFaaS (Chiplet Foundry-as-a-Service)'. This service is a one-stop solution that provides integrated support for all stages of product development, including I/O chiplets, interface IP, advanced packaging technology, and software development kits (SDKs), based on the customer's core chip design. Through this, customers can reduce development periods and costs, and optimize performance, and it is expected to be utilized in various industries.
Currently, Aegic Land is securing 3nm and 5nm advanced process technology and CoWoS packaging capabilities centered on its Taiwan R&D center, and in April of last year, it was selected for the 'Development of On-Device AI Optimized Chiplet-based Hub SoC' project, proving its technological prowess and business drive.
CEO Lee Jong-min said, “Securing technological competitiveness is more important than ever amid the structural changes in the chiplet-based semiconductor industry,” and “Aegic Land will lead the next-generation semiconductor market based on differentiated design capabilities and platform strategies.”
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