Deca Technologies (Deca) announced that it has signed an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies at IBM’s advanced packaging facility in Bromont, Quebec, Canada. The agreement will see IBM build a high-volume manufacturing line focused on Deca’s M-Series Fan-out Interposer Technology (MFIT™).
This collaboration between the two companies is in line with IBM’s business strategy to develop advanced packaging capabilities. IBM Canada’s Bromont facility is one of the largest semiconductor assembly and test facilities in North America and has been leading the way in packaging technology innovation for over 50 years. IBM’s recent major investment in expanding its capabilities has positioned the facility as a key hub for high-performance packaging and chiplet integration, supporting technologies such as MFIT that are essential for artificial intelligence (AI), high-performance computing (HPC) and data center applications.
Deca’s M-Series platform is the world’s most-sold fan-out packaging technology, with over 7 billion M-Series units shipped to date. MFIT builds on this proven platform by integrating embedded bridge dies for last-mile processor and memory integration, providing high-density, low-latency connectivity between chiplets. MFIT is a cost-effective solution for full-silicon interposers that delivers improved signal integrity, greater design flexibility, and scalable formats for the growing number of AI, HPC, and data center applications.
This collaboration is the result of IBM and Decca’s shared goal to advance next-generation semiconductor packaging. By combining IBM’s advanced packaging capabilities with Decca’s proven technology, the two companies are expanding their global supply chain for high-performance chiplet integration and the future of advanced computing systems.
“Advanced packaging and chiplet technology are essential for faster, more efficient computing solutions in the AI era,” said Scott Sikorski, general manager, IBM Chiplet and Advanced Packaging Business Development. “Deca will help IBM’s Bromont facility stay at the forefront of this innovation, supporting IBM’s commitment to helping customers get products to market faster and deliver better performance for AI and data-intensive applications.”
“IBM, with its rich history of innovation in semiconductor technology and advanced packaging technologies, is the ideal partner to bring Deca’s MFIT to volume manufacturing,” said Tim Olson, Deca founder and CEO. “We are excited to work together to bring Deca’s advanced interposer technology to the North American ecosystem.”
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