DS… 2025 Super Gap Startup 1000+ Project Semiconductor Sector Selected

– Plans to launch an interactive semiconductor package defect detection system that operates within the equipment without external connection, within a mass production line with strict security

[Reference photo: Advanced semiconductor package defect detection solution ‘DeepSeers’]
[Reference photo: Advanced semiconductor package defect detection solution 'DeepSeers']

DS (CEO Ki-Jun Han), a developer of defect detection solutions specializing in high-performance advanced semiconductor packages, has been selected as a promising startup in the system semiconductor field for the '2025 Ultra-Gap Startup 1000+ Project' hosted by the Korea Institute for Startups and Entrepreneurship Development.

The Super Gap Startup 1000+ project is a national strategic project to directly foster deep-tech technologies with global competitiveness, and DS has been recognized for its technological prowess in defect detection solutions, which are becoming increasingly important due to the increasing demand for HBM (High Bandwidth Memory) semiconductors.

DS's core technology, DeepSeers, is a solution that detects images obtained in real time through 2D and 3D-based optical systems at high speed using deep learning technology. In particular, the recently emerging advanced package requires 3D technology for measuring wafer warpage and gaps in addition to 2D image inspection. DeepSeers is a source technology that can be quickly applied to mass production equipment after high-speed shooting and defect detection.

Deepseers, first launched in September 2024, has contributed to improving the yield of OSAT (Outsourced Semiconductor Assembly and Test) companies, especially through its technology to accurately classify genuine and potential defects after initial defect detection. It has already been delivered to five domestic and foreign companies and has already signed more than 10 new contracts in 2025.

Meanwhile, DS is developing AI and semiconductor convergence technology together with a number of large language model development startups, and through this Ultra-Gap Startup 1000+ project, it plans to launch a new interactive semiconductor package defect detection system that operates within the equipment without an external connection due to the characteristics of the mass production line where security is strict.

DS Han Ki-jun, CEO, said, “DS is a startup leading the convergence of advanced packaging technology and AI technology that has been attracting attention recently, and has already achieved more than 500 million won in sales in 2024 in the first quarter of this year.” He added, “We will expand the market and achieve sustainable growth based on differentiated technologies and solution precision.”

Established in May 2021, DS has been recognized for its technology and quality by being the only Korean company to be selected as an innovative company at the Overseas Talent Innovation Competition held in Nanning, China in July 2024, and has introduced solutions specialized in HBM semiconductor package defect detection technology. It also won the grand prize at the 2024 Incheon Creative Economy Innovation Center Youth Entrepreneurship Challenge and is currently working with the Bank of Korea Youth Entrepreneurship Foundation D-Camp as a placement company.