Zeus Co., Ltd. (CEO Jong-Woo Lee) , a specialized semiconductor/display manufacturing equipment and robot company, announced on the 19th that it will launch a new automated photonic debonding automation equipment for advanced semiconductor manufacturing in the market targeting integrated device manufacturers (IDMs) in the U.S. in cooperation with PulseForge, a U.S. company with innovative technology in the field of advanced semiconductor packaging.
The equipment is the latest technology that can be introduced to keep up with the rapidly developing AI chip development speed, providing semiconductor manufacturers with a wafer debonding solution that combines high productivity and cost efficiency.
As the demand for heterogeneous integration, 2.5D/3D packaging, and high bandwidth memory (HBM) rapidly increases in the semiconductor market, the importance of accurate and damage-free wafer debonding technology is growing day by day. The photonic debonding automation equipment is being developed jointly by Zeus and Pulseforge, and uses high-intensity pulsed light to gently separate wafers. This technology can minimize wafer damage and waste that may occur during the production process, thereby improving product quality and reducing manufacturing costs.
“Our partnership with Pulseforge combines industry-leading technologies in photonic debonding and semiconductor manufacturing,” said Zeus CEO Jong-Woo Lee. “This automated photonic debonding equipment is expected to be a significant advancement in next-generation packaging technology, improving process efficiency and reducing operating costs.”
As the use of photonic debonding technology is rapidly expanding in the semiconductor industry, the first equipment developed through the collaboration between the two companies is scheduled to be delivered to a major IDM company in the United States.
The main advantages of photonic debonding automation equipment include: ▲Automated operation: Efficiently streamlining semiconductor manufacturing through consistent processes ▲Damage-free processing: Minimizes mechanical and chemical damage to the wafer, providing improved yield even on thin wafers ▲Supports heterogeneous integration and advanced packaging Scalability: Can be used for various wafer sizes and temporary bonding materials ▲Improved yield and cost efficiency: Cycle time optimized for mass production, reduced manufacturing costs, etc.
Meanwhile, Zeus will be participating in 'SEMICON KOREA 2025' held at COEX in Seoul from the 19th to the 21st. It will set up an event booth in Hall A #A754 on the 1st floor and will provide detailed information about the photonic debonding automation equipment that will be released this time.
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