AI semiconductor company Rebellion (CEO Park Sung-hyun) announced on the 23rd that it has signed a strategic cooperation agreement with system semiconductor design specialist Coasia Semi (CEO Shin Dong-soo) for joint development of AI chiplets and software solutions for data centers.
This agreement was signed on the 22nd at Rebellion’s Bundang headquarters, and was attended by Rebellion and Coasia Semi’s CEOs, as well as Coasia Group Chairman Lee Hee-joon. The two companies agreed to develop and supply chiplet technology based on the next-generation AI semiconductor ‘REBEL’, and decided to establish a cooperative system for expanding the global AI ecosystem.
Chiplet technology is a method of combining individual semiconductor chips into a single package, and has advantages in design flexibility, yield improvement, and performance/power optimization compared to the existing single SoC (System-on-Chip). In this collaboration, Coasia Semi will provide its 2.5D silicon interposer and advanced packaging technology, while Rebellion will be responsible for AI chip design and software solution development.
The two companies had already jointly won a national project to develop chiplets for multi-petaflops PIM servers in April, and this collaboration signifies an expansion into the commercialization phase based on this. The development is scheduled to be completed by the end of 2026, and the products are planned to be supplied to domestic and overseas data centers thereafter.
This collaboration will also involve global partners in the post-process (assembly and test, OSAT) and semiconductor design assets (IP), with the goal of building an AI semiconductor supply chain encompassing fabless-packaging-OSAT-IP. Through this, it is expected to lay the foundation for entering major markets such as the US, Europe, and Japan.
Rebellion is currently promoting the commercialization of the high-performance AI semiconductor 'ATOM-Max' and plans to unveil the new product 'REBEL-Quad' with high-bandwidth memory (HBM3E) in the second half of the year. This collaboration is expected to serve as the technological foundation for the development of chiplet-based products that expand Rebellion's Quad.
Park Sung-hyun, CEO of Rebellion, said, “In order to respond to the rapidly changing AI market, we are pursuing a product diversification strategy utilizing chiplet architecture and advanced packaging capabilities,” adding, “The two companies will cooperate to create a technology ecosystem that goes beyond simple joint development and leads to commercialization.”
Shin Dong-soo, CEO of Koasia Semiconductor, said, “The technological collaboration between the two companies is expected to play a pivotal role in the AI semiconductor ecosystem,” and added, “We are also pursuing mass production contracts targeting global customers, and we will strengthen our position in the AI semiconductor market based on our technological competitiveness.”
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