DeepX (CEO Nok-won Kim), a specialized on-device AI semiconductor company, announced on the 13th that it has signed a process agreement with Samsung Foundry and Gaonchips for the development of the next-generation generative AI semiconductor 'DX-M2' based on a 2-nanometer (nm) process.
Through this agreement, DeepX will begin full-scale development of DX-M2, an ultra-low-power on-device inference semiconductor product equipped with generative AI capabilities. DeepX will become a commercial customer of Samsung Foundry's 2nm process, and the MPW (Multi Project Wafer) for prototype production is targeted for the first half of 2026, with mass production targeted for 2027.
DeepX is noting that its 2nm process based on Gate-All-Around (GAA) can show approximately twice the efficiency (power consumption per performance) of the 5nm process used in the existing DX-M1. Generative AI models require a high amount of computation, and operating them in an on-device environment with significant power and thermal constraints has been considered a technical challenge.
DeepX has conducted a comprehensive analysis of power efficiency, manufacturing cost, and yield based on Samsung Foundry's 2nm process since the end of 2023, and has decided to pursue the development of DX-M2 after determining that it can meet the performance conditions required for generative AI for on-device use.
The DX-M2 is designed to perform real-time inference on generative AI models with approximately 20 billion parameters at a maximum speed of 20-30 tokens per second (TPS), while consuming less than 5W of power. This will enable autonomous execution of expert-level AI models even on devices with limited power processing capabilities, such as robots, home appliances, and laptops.
Through this product, DeepX aims to realize 100B-class quasi-AGI performance on-device by running 20B-class generative AI models such as 'DeepSeek' and 'LLaMA 4' together with the MOE (Mixture of Experts) structure.
In this regard, DeepX began designing a new generative AI processor in early 2024 and has now completed development of an initial prototype. DeepX aims to launch an AI semiconductor that offers superior computational performance, intelligence, and power efficiency compared to global competitors.
DeepX CEO Kim Nok-won said, “DX-M2 is a product that realizes the possibility of on-device implementation of generative AI,” and “DeepX will continue to accelerate the popularization and industrialization of AI through high-performance and high-efficiency AI semiconductor technology.”
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