ASIC Land (CEO Jongmin Lee) , a company specializing in application-specific integrated circuit (ASIC) design, announced that it will participate in the domestic semiconductor exhibition 'SEDEX 2025' held at COEX in Seoul from October 22nd to 24th and unveil three core technology platforms that support customer-tailored semiconductor development.
SEDEX (Semiconductor Expo) is a leading semiconductor exhibition hosted by the Korea Semiconductor Industry Association (KSIA), with major companies from all semiconductor industries, including memory, system semiconductors, and equipment/components, participating.
At this exhibition, ASICLAND will introduce three of its main technologies: ▲'ASICLAND AxHub™ Platform' ▲'High-Performance SoC Platform' ▲'ASICLAND Chiplet Platform', and will provide on-site consultations on customized semiconductor design, verification, and packaging solutions.
The 'AxHub™ platform' is a platform that supports the entire ASIC development process from PoC (Proof of Concept) to packaging using pre-verified interface dies. It was developed with the aim of solving problems faced by fabless customers such as complex design structures, long development periods, and initial verification costs.
The 'High-Performance SoC Platform' applies the Arm architecture based on the 5nm process to provide a solution suitable for the AI and high-performance computing (HPC) markets that require high performance and high reliability.
The 'Chiplet Platform' implements an ultra-high-speed, low-power interface between HBM (High Bandwidth Memory) and logic die based on TSMC's CoWoS (Co-packaged with Silicon Interposer) packaging technology, providing an optimal environment for the development of high-performance systems such as AI servers, data centers, and cloud infrastructure.
The three platforms are designed to be independently usable yet interconnected, providing customers with the flexibility to apply them in an optimized combination based on the scale of their project or performance objectives.
In addition, Ageland plans to simultaneously deliver technology and experience by operating various visitor participation programs such as AI photo booths, lucky draws, and time attack events at the exhibition booth.
“Through SEDEX 2025, we aim to emphasize our technological capabilities that can immediately respond to customer needs from ASIC design to packaging,” said Jongmin Lee, CEO of Aegic Land. “We will continue to strengthen our competitiveness in the global market by simultaneously increasing customer development speed and quality with differentiated technologies in terms of design flexibility and verification efficiency.”
- See more related articles
You must be logged in to post a comment.