Taesung (CEO Jonghak Kim), a specialized wet equipment company for printed circuit boards (PCBs) and semiconductor substrates, announced that it participated in the 'KPCA Show 2025 (22nd International Advanced Semiconductor Substrate Packaging Industry Exhibition)' held at Songdo Convensia in Incheon in September and showcased its composite copper foil and glass substrate-related technology and equipment.
At this exhibition, Taesung presented its vision to expand beyond its existing PCB wet equipment business and become a specialized manufacturer of composite copper foil equipment. After unveiling its commercialization plans through equipment demonstrations last year, this year the company demonstrated its technological prowess by exhibiting composite copper foil materials produced using its own equipment. Composite copper foil is a key material for high-performance electronic devices, and Taesung plans to accelerate its global market entry based on its production technology.
Taesung also introduced a lineup of equipment applicable to 12 specific processes, building on its proven track record of supplying cleaning and etching equipment for glass substrate processes. A solution was also unveiled to enhance precision and yield by advancing TGV (Through Glass Via) etching technology for glass substrates.
The company stated, "We have secured competitiveness by combining the wet processing technology we have accumulated in the PCB equipment business with the glass substrate process." The company added, "Following the supply of pilot equipment this year, we have laid the foundation for securing orders for mass production equipment in the glass substrate market, which is expected to expand significantly starting next year." The company also explained that it is currently supplying samples of roll-to-roll (RTR) equipment for composite copper foil production to domestic and international customers and is currently negotiating specific supply terms.
Meanwhile, Taesung CEO Kim Jong-hak received the Minister of Trade, Industry and Energy Award in recognition of his contribution to developing Korea's first wet facility dedicated to semiconductor glass substrates and RTR composite copper foil equipment.
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